Techo Rama

3D electronics have got a new makeover; silicon wafer chips are now being shaped as lego bricks, this has made them enter the new era of chip designing. The modern electronics uses the etching methods involving the flat silicon wafers and inturn increasing the speed of the chip by mounting more components on relatively lesser surface area. Most of the modern day researchers consider this decade old technique to be obsolete. They have come up with a better option; they think it would be a better to design a silicon chip using 3-D layering. I am certainly of the opinion that designing chips through this method will considerably enhance the speed as well as mounting capacity of a single silicon chip. Standard silicon etching methods are involved in this new technique but with a little variation, instead of flat silicon chips layering of the chips is done in the form of a stack. The stacking thus is done in the form of pyramids, which are tapering towards the bottom (500 microns) and have a wider tip (100 microns). The different silicon chips are inturn diffused together so as to form a single etched microchip. It would rather have wider applications in the field of ‘Plasmonics’, ‘photoelectronics’ as well as ‘Optical fiber communication’.